白光珠，博士，实验师。2020年1月毕业于北京科技大学新金属材料国家重点实验室。2020年7月到2023年5月在西北有色金属研究院工作，2023年6月加入山西师范大学材料科学研究院工作。主要从事高导热金属基复合材料、铝电解电容器用烧结多孔阳极箔研究和应用，主持山西省基础研究计划青年科学研究项目、山西省高等学校科技创新项目、陕西省重点研发计划项目、企业横向项目各1项，参与国家重点研发计划、国家自然科学基金等多项项目。目前在JMST、Materials & Design、JMR&T、Ceramics International、Journal of Alloys and Compounds等期刊发表多篇SCI学术论文，授权中国发明专利11项，担任JMR&T、JOM、J MATER ENG PERFORM等期刊审稿人。
联系方式：E-mail：guangzhubai@sxnu.edu.cn
主持项目：
(1) 山西省科技厅, 山西省基础研究计划青年科学研究项目, 纳米梯度界面设计轻量化高导热金刚石/镁复合材料及应用, 2024-07至2027-06, 5万元, 在研, 主持.
(2) 山西省教育厅, 山西省高等学校科技创新项目, 2024L148, 增材制造新型铝电解电容器用阳极箔及机理研究, 2024-07至2026-06, 1万元, 在研, 主持.
(3) 陕西省科技厅, 陕西省重点研发一般工业项目, 2023-YBGY-463, 中高压铝电解电容器用先进金属基复合三维多孔阳极箔开发与应用, 2023-01至2024-12, 60万元, 在研, 主持.
(4) 西安稀有金属材料研究院有限公司, 企业横向, Y2106S, 粉层电子铝箔的开发, 2021-07至2023-06, 50万元, 结题, 主持.
(5) 科技部, 国家重点研发计划, 2016YFB0402102, 用于激光晶体冷却的新型散热材料及散热机制, 2016-01至2020-12, 35万元, 结题, 参与.
发表论文：
(1) Guangzhu Bai*, Jianwei Li , Yongjian Zhang, Changrui Wang, Xitao Wang, Hailong Zhang*. A numerical study of the effect of interfacial thermal resistance on thermal conductivity of Cu-B/diamond composites, Vacuum, 230 (2024) 113654.
(2) Guangzhu Bai*, Changrui Wang*, Fang Wang, Yajun Ren, and Xiaohong Xu. Tunable electrical and mechanical properties of anode foils for aluminum electrolytic capacitors prepared by additive manufacturing technology, Journal of Materials Research and Technology, 30 (2024): 9647-9655.
(3) Guangzhu Bai*, Yongjian Zhang, Wei Shi, Xianhao Wang, Huihui Zhu, Fang Wang, and Hailong Zhang*. Investigation of the matrix and interface of Cu-B/diamond composite by Atom probe tomography, Ceramics International, 50 (2024): 12915-12923.
(4) Guangzhu Bai*, Zhibin Chen, Jie Liu, Fang Wang, and Yusheng Zhang. Microstructure Evolution and Performance Enhancement of Sintered Aluminum Foils for Aluminum Electrolytic Capacitors, Journal of Electronic Materials, 53 (2024): 2026-2039.
(5) Yongjian Zhang, Guangzhu Bai, Xiangyu Zhu, Jingjie Dai, Xitao Wang, Jinguo Wang, Moon J. Kim, and Hailong Zhang*.Manipulating in-situ discrete carbide interlayer to achieve high thermal conductivity in Cu-B/diamond composite. Materials Today Communications, 34 (2023): 105357.
(6) Luhua Wang, Guangzhu Bai, Ning Li, Liyin Gao, Jianwei Li, Ke Xu, Xitao Wang, Hailong Zhang*, Jinguo Wang, and Moon J. Kim. Unveiling interfacial structure and improving thermal conductivity of Cu/diamond composites reinforced with Zr-coated diamond particles. Vacuum, 202 (2022): 111133.
(7) Yongjian Zhang, Guangzhu Bai, Xiaoyan Liu, Jingjie Dai, Xitao Wang, and Hailong Zhang*. Reinforcement size effect on thermal conductivity in Cu-B/diamond composite. Journal of Materials Science & Technology, 91 (2021): 1-4.
(8) Guangzhu Bai, Yongjian Zhang, Jingjie Dai, Xitao Wang, and Hailong Zhang*. Mechanical properties of Cu-B/diamond composites prepared by gas pressure infiltration. Journal of Materials Engineering and Performance, 29 (2020): 3107-3119.
(9) Guangzhu Bai, Yong Jian Zhang, XiaoYan Liu, JingJie Dai, Xitao Wang, and Hailong Zhang*. High-temperature thermal conductivity and thermal cycling behavior of Cu–B/diamond composites. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (2019): 626-636.
(10) Yongjian Zhang, Jingjie Dai, Guangzhu Bai, and Hailong Zhang*. Microstructure and thermal conductivity of AlN coating on Cu substrate deposited by arc ion plating. Materials Chemistry and Physics, 241 (2020): 122374.
(11) Guangzhu Bai, Yongjian Zhang, Jingjie Dai, Luhua Wang, XitaoWang, JinguoWang, Moon J. Kim, Xizheng Chen, and Hailong Zhang*.Tunable coefficient of thermal expansion of Cu-B/diamond composites prepared by gas pressure infiltration, Journal of Alloys and Compounds, 2019, 152: 265-275.
(12) Guangzhu Bai, Luhua Wang, Yongjian Zhang, XitaoWang, JinguoWang, Moon J. Kim, and Hailong Zhang*.Tailoring interface structure and enhancing thermal conductivity of Cu/diamond composites by alloying boron to the Cu matrix, Materials Characterization, 2019, 152: 265-275.
(13) LuhuaWang, Jianwei Li, Guangzhu Bai, Ning Li, Xitao Wang, Hailong Zhang*, jinguo Wang, and Moon J. Kim. Interfacial structure evolution and thermal conductivity of Cu-Zr/diamond composites prepared by gas pressure infiltration. Journal of Alloys and Compounds, 781 (2019): 800-809.
(14) Guangzhu Bai, Ning Li, Xitao Wang, Jinguo Wang, Moon J. Kim, and Hailong Zhang*. High thermal conductivity of Cu-B/diamond composites prepared by gas pressure infiltration, Journal of Alloys and Compounds, 794 (2018): 473-481.
(15) LuhuaWang, Jianwei Li, Massimo Catalano, Guangzhu Bai, Ning Li, jingjie Dai, Xitao Wang, Hailong Zhang*, Jinguo Wang, and Moon J. Kim. Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layer. Composites Part A: Applied Science and Manufacturing, 113 (2018): 76-82.
(16) Guangzhu Bai, ZhengLiu*, Jixing Lin, Zhaofu Yu, Yongmei Hu, and Cuie Wen*. Effects of the addition of lanthanum and ultrasonic stirring on the microstructure and mechanical properties of the in situ Mg2Si/Al composites, Materials and Design, 2016, 90: 424-432.
(17) Jixing Lin*, Guangzhu Bai, Zheng Liu, Liyuan Niu, Guangyu Li, and Cuie Wen*. Effect of ultrasonic stirring on the microstructure and mechanical properties of in situ Mg2Si/Al composite. Materials Chemistry and Physics, 178 (2016): 112-118.
授权专利：
（1）白光珠, 史瑞科, 彭湃, 等, 一种结合气溶胶喷涂法制备铝电解电容器阳极箔的方法, 2024-9-24, 中国, CN202210951468.3 (授权).
（2）白光珠, 陈志斌, 史瑞科, 等, 一种基于气体压力浸渗的烧结式阳极箔的制备方法, 2024-5-28, 中国, CN202211057324.X (授权).
（3）白光珠, 张于胜, 史瑞科, 等, 一种低成本低污染铝电解电容器阳极箔及其制备方法, 2023-7-14, 中国, CN202110942164.6 (授权).
（4）白光珠, 张于胜, 史瑞科, 等, 一种利用冷轧机制备铝电解电容器阳极箔的方法, 2021-11-23, 中国, CN202111025891.2 (授权).
（5）史瑞科, 白光珠, 陈志斌, 等, 一种纳米介电粉包覆的铝电解电容器烧结箔及其制备方法, 2024-5-28, 中国, CN202211057279.8 (授权).
（6）张海龙, 白光珠, 戴景杰, 等, 一种热管理复合材料拉伸测试样品及其制备方法,中国, 2022-8-23, CN201911142156.2, (授权).
（7）史瑞科, 张于胜, 白光珠, 等, 一种铝电解电容器阳极烧结箔用双组分铝浆及其制备方法, 2022-8-30, 中国, CN113658803B (授权).
（8）史瑞科, 张于胜, 白光珠, 等, 一种含巨介电粉的铝电解电容器用材料及其制备方法, 2023-3-10, 中国, CN113643900B (授权).
（9）田宁, 史瑞科, 王海丽, 白光珠, 等, 一种多粉末均匀分散的烧结式阳极箔制备方法, 2022-11-18, 中国, CN115106534B (授权).
（10）孙国栋, 徐嘉, 刘璐, 白光珠, 等, 一种调控形核和生长过程制备纳米钼粉的方法及应用, 2020-12-07, 中国, CN112222419B (授权).
（11）孙国栋, 赵会宇, 张思雨, 刘璐, 白光珠, 等, 一种调控形核和生长过程制备纳米钨粉的方法及应用, 2020-12-07, 中国, CN112222419 (授权).